CBG300F
Stable Dk, ultra-low loss laminate for high-frequency applications.
CBG300F is a low-loss thermoset laminate for high-speed digital, backplane and multilayer designs.
- Dielectric Constant (10 GHz): 3.05±0.05
- Dissipation Factor (10 GHz): 0.0037
- CTE X/Y/Z: 15/15/40 ppm/°C
- Glass Transition Temperature: >280 °C
- Copper Foil Peel Strength: 3.9 (0.68) lbs/in (N/mm)
- Moisture Absorption: 0.05 %
- Flammability: UL 94 V-0
Product Overview
CFG294 series laminates offer exceptional electrical performance and design stability for RF / microwave circuits, antennas, filters, and high-speed digital applications. Typical values are averages from production testing; standard thickness, panel size and copper foil options are customizable on request.
- Dielectric Constant (10 GHz)
- 2.94 ± 0.03
- Dissipation Factor (10 GHz)
- 0.0010
- Thermal Coefficient of Dk
- 9.8 ppm/°C
- CTE X/Y/Z (-55 °C ~ 288 °C)
- 8 / 9 / 20 ppm/°C
- Thermal Conductivity (80 °C)
- 0.68 W/m·K
- Flammability
- UL 94 V-0
Typical Applications
Typical Electrical Properties
| Property | Test Method | CFG294 | CFG294G2 |
|---|---|---|---|
| Dielectric Constant (10 GHz) | IPC-TM-650 2.5.5.5 | 2.94 ± 0.03 | 2.94 ± 0.03 |
| Design Dk (8–40 GHz) | Differential phase length | 2.93 | 2.93 |
| Dissipation Factor (10 GHz) | IPC-TM-650 2.5.5.5 | 0.0011 | 0.0010 |
| Thermal Coefficient of Dk | IPC-TM-650 2.5.5.5 | 9.8 ppm/°C | 9.8 ppm/°C |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | 2.5×10⁷ MΩ·cm | 2.5×10⁷ MΩ·cm |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | 3.9×10⁸ MΩ | 3.9×10⁶ MΩ |
| Breakdown Voltage | IPC-TM-650 2.5.6 | 45 kV | 45 kV |
| Electrical Strength | IPC-TM-650 2.5.6.2 | 38 kV/mm | 38 kV/mm |
| CTE X/Y/Z (-55 °C ~ 288 °C) | IPC-TM-650 2.4.41 / 2.4.24 | 8/9/20 ppm/°C | 8/9/20 ppm/°C |
| Td (5% Weight Loss) | IPC-TM-650 2.4.24.6 | 506 °C | 506 °C |
| Peel Strength (1 oz, after thermal stress) | IPC-TM-650 2.4.8 | 8.6 lbs/in (1.5 N/mm) | 8.6 lbs/in (1.5 N/mm) |
| Thermal Conductivity (80 °C) | ASTM D5470 | 0.68 W/m·K | 0.68 W/m·K |
| Moisture Absorption | IPC-TM-650 2.6.2.1 | 0.02 % | 0.02 % |
| Flammability | UL 94 | V-0 | V-0 |
Note: The typical values are averages from product testing and are not intended for specification purposes.
Low-loss laminates for macro base station antennas and massive MIMO arrays.
Low-outgassing grades with NASA ASTM E595 data for space-grade hardware.
Stable Dk over temperature for radar and mission-critical RF systems.
Tight Dk tolerance enables precise, repeatable filter designs.
Low skew and low loss for high-speed digital and backplane circuits.
- CFG294 Series Data SheetPDF
- Processing GuidelinesPDF
- NASA Outgassing ReportPDF
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