Technology & Manufacturing

Capabilities

Process capability and engineering services from material selection through volume production.

PCB Fabrication

Rigid and high-frequency capability. Sample values reflect prototype capability; mass production values reflect volume manufacturing.

Standard multilayer rigid PCB capability, including HDI and heavy copper.

Parameter	2022 Sample	2022 Mass Production	2023 Sample	2023 Mass Production
Layer Count	40L	32L	50L	36L
Finished Board Thickness	0.2-12.0mm	0.4-6.0mm	0.2-15.0mm	0.3-7.0mm
Thickness Tolerance	±8%	±10%	±8%	±8%
Min Trace/Space	2mil/2mil	3mil/3mil	1.5mil/1.5mil	2mil/2mil
Min Hole-to-Trace Clearance	5mil	6mil	5mil	5mil
Copper Weight	1-10oz	1-6oz	1-12oz	1/3-8oz
Layer Registration Accuracy	1mil	1mil	0.8mil	1mil
Min Through Hole Diameter	0.1mm	0.15mm	0.075mm	0.10mm
Min Blind/Buried Via Diameter	0.075mm	0.075mm	0.05mm	0.075mm
Max Aspect Ratio	30:1	25:1	35:1	30:1
Etching Tolerance	±10%/±1mil	±10%/±1mil	±10%/±0.8mil	±10%/±1mil
Min Solder Bridge	3mil	4mil	2mil	3mil
Impedance Control Tolerance	±5%	±8%	±5%	±7%
HDI Level	7th Order	3rd Order	9th Order	5th Order
Surface Finish	ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP, Carbon	ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP, Carbon	ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP, Carbon	ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP, Carbon
Material Types	Shengyi, Taiwan Union, ITEQ, NanYa, Rogers, Panasonic, Isola (TG135/TG150/TG170, CAF/CTI>600, Halogen Free)	Shengyi, Taiwan Union, ITEQ, NanYa, Rogers, Panasonic, Isola (TG135/TG150/TG170, CAF/CTI>600, Halogen Free)	Shengyi, Taiwan Union, ITEQ, NanYa, Rogers, Panasonic, Isola (TG135/TG150/TG170, CAF/CTI>600, Halogen Free)	Shengyi, Taiwan Union, ITEQ, NanYa, Rogers, Panasonic, Isola (TG135/TG150/TG170, CAF/CTI>600, Halogen Free)

PTFE and hybrid stack-up capability for RF, microwave and high-speed digital designs.

Parameter	Sample	Mass Production
Material System	PTFE, Hydrocarbon Resin, Other Materials	PTFE+Ceramic, PTFE+Glass Fiber+Ceramic, PTFE+Glass Fiber
Layer Count	24L	20L
Panel Size	850×700mm	720×650mm
Profile Tolerance	±0.05mm	±0.10mm
Slot Tolerance	Normal Slot ±0.08, Routing Slot ±0.10	Normal Slot ±0.10, Routing Slot ±0.13
Layer Registration	2mil	3mil
Hybrid Lamination	PTFE + Glass Ceramic + FR4	PTFE + Glass Ceramic + FR4
Minimum Hole Size	0.075mm	0.10mm
Minimum Hole Spacing	0.20mm	0.25mm
Hole Diameter Tolerance	±0.05mm	±0.075mm
Maximum Aspect Ratio	16:1	12:1
Hole Copper Uniformity	COV≤5%	COV≤7%
Resin Filled Via Aspect Ratio	12:1	12:1
Via Type	Through Hole / Blind Via	Through Hole / Blind Via
Trace Width Tolerance	±0.6mil	±1mil
Impedance Tolerance	±5%	±8%
Warpage	0.50%	0.75%
Special Process	POFV(VIPPO), Sequential Lamination, Local Lamination, Long/Short Gold Finger, Counterbore, Back Drill, Side Metallization, N+N Structure, Edge Plating, Thick Copper, HDI	POFV(VIPPO), Sequential Lamination, Local Lamination, Long/Short Gold Finger, Counterbore, Back Drill, Side Metallization, N+N Structure, Edge Plating, Thick Copper, HDI
Approved Brands	Shengyi, ITEQ, Taiwan Union, Panasonic(M4/M6/M7/M8), Rogers, Taconic, Wangling, Ventec, Isola	Shengyi, ITEQ, Taiwan Union, Panasonic(M4/M6/M7/M8), Rogers, Taconic, Wangling, Ventec, Isola

Flexible & Rigid-Flex

Rigid-flex and flexible circuit capability, including any-layer HDI and LCP support.

Rigid-flex capability covering bookbinder, air gap and asymmetrical stack-ups.

Parameter	2022 Sample	2022 Mass Production	2023 Sample	2023 Mass Production
Layer Count	18L	12L	20L	18L
Panel Size	400×540mm	400×540mm	400×540mm	400×540mm
Finished Board Thickness	0.25-3.2mm	0.25-3.2mm	0.25-5.0mm	0.25-3.2mm
Min Trace/Space	2mil/2mil	2.5mil/2.5mil	1.5mil/1.5mil	2mil/2mil
Min Hole-to-Trace Clearance	5mil	5mil	4mil	5mil
Copper Weight	1/3-2oz	1/3-2oz	1/3-3oz	1/3-2oz
Layer Registration Accuracy	1mil	1mil	0.8mil	1mil
Min Through Hole Diameter	0.10mm	0.15mm	0.075mm	0.10mm
Min Laser Via Diameter	0.05mm	0.075mm	0.05mm	0.05mm
Max Aspect Ratio	12:1	10:1	16:1	12:1
Etching Tolerance	±10%/±1mil	±10%/±1mil	±10%/±0.8mil	±10%/±1mil
Min Solder Bridge	3mil	4mil	2mil	3mil
Impedance Control Tolerance	±5%	±8%	±5%	±7%
Surface Finish	ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP	ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP	ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP, Carbon	ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP
Supported Structures	Single-sided Core, Symmetrical Stack-up, Multilayer Stack-up, Gold Finger, Air Gap, Asymmetrical Stack-up, HDI Structure, Build-up Structure, Bookbinder Structure, High-speed Design	Single-sided Core, Symmetrical Stack-up, Multilayer Stack-up, Gold Finger, Air Gap, Asymmetrical Stack-up, HDI Structure, Build-up Structure, Bookbinder Structure, High-speed Design	Single-sided Core, Symmetrical Stack-up, Multilayer Stack-up, Gold Finger, Air Gap, Asymmetrical Stack-up, HDI Structure, Build-up Structure, Bookbinder Structure, High-speed Design	Single-sided Core, Symmetrical Stack-up, Multilayer Stack-up, Gold Finger, Air Gap, Asymmetrical Stack-up, HDI Structure, Build-up Structure, Bookbinder Structure, High-speed Design
Material Types	Shengyi, Ventec, Taiwan Union, ITEQ, Panasonic, Rogers, Isola, Arlon	Shengyi, Ventec, Taiwan Union, ITEQ, Panasonic, Rogers, Isola, Arlon	Shengyi, Ventec, Taiwan Union, ITEQ, Panasonic, Rogers, Isola, Arlon	Shengyi, Ventec, Taiwan Union, ITEQ, Panasonic, Rogers, Isola, Arlon

Flexible circuit capability including any-layer HDI and LCP material support.

Parameter	Sample	Mass Production
Layer Count	12	16
Minimum Dielectric Thickness (μm)	12.5	12.5
Minimum BGA Pitch (μm)	150	100
Minimum Board Thickness (μm)	50	50
Maximum Panel Size (mm)	610×1200	610×1200
Minimum Base Copper Thickness (μm)	9	6
Maximum Base Copper Thickness (μm)	35	35
Minimum Trace/Space (μm)	40/40	35/35
Pattern Registration Tolerance (μm)	±50	±20
Minimum Pattern-to-Edge Clearance (mm)	0.10	0.07
Etching Tolerance (μm)	±20	±15
Minimum Through Hole Diameter (mm)	0.10	0.075
Minimum Blind Via Diameter (mm)	0.05	0.05
Hole Diameter Tolerance (mm)	±0.05	±0.05
Impedance Control Tolerance	±10%	±5%
Outline Tolerance (mm)	±0.10	±0.05
Surface Finish	HASL, ENIG, Immersion Silver, OSP, ENEPIG, Hard Gold	HASL, ENIG, Immersion Silver, OSP, ENEPIG, Hard Gold
Stiffener Type	FR4, PI, Stainless Steel	FR4, PI, Stainless Steel
Stiffener Registration Tolerance (mm)	±0.20	±0.10
HDI Capability	4-Layer Any-Layer Interconnect	6-Layer Any-Layer Interconnect
LCP Material Support	OK	OK

Assembly & Sourcing

SMT assembly, BOM management and component traceability.

Surface-mount assembly capability for standard and non-standard processes.

Specification	Standard Process	Advanced / Non-Standard
Maximum Component Height	≤ 6.5 mm	6.5 mm < H ≤ 15 mm
Maximum Component Size	200 × 125 mm	> 200 × 125 mm
Minimum Chip Size	0201 (0.6 × 0.3 mm)	01005 (0.4 × 0.2 mm)
Fine-Pitch IC Lead Pitch	≥ 0.4 mm	0.3 mm < Pitch < 0.4 mm
BGA / CSP Ball Pitch	≥ 0.5 mm	0.3 mm < Pitch < 0.5 mm

Component sourcing, verification and traceability services.

Item	Category	Standard Process	Advanced / Non-Standard
Component Sourcing	Supply Channel	Authorized Distributors	Customer-Designated Sources
Component Types	Active Components	Resistors, Capacitors, Inductors, ICs	FPGA, ASIC, RF Devices
Package Support	Standard Packages	0201, QFP, SOP, SOIC	01005, CSP, BGA, LGA
Obsolete Components	Lifecycle Status	Active Production Parts	EOL / Hard-to-Find Components
Alternative Components	Engineering Support	Customer Approved	Cross-Reference & Replacement Analysis
BOM Verification	Engineering Review	Quantity Check, MPN Check	Full DFM Review, DFA Review
Component Traceability	Traceability	Batch Tracking	Full Lot-Level Traceability
Moisture Sensitive Devices	MSL Control	MSL 1-3	MSL 4-6 With Dry Cabinet Control
Counterfeit Prevention	Incoming Inspection	Visual Verification	X-Ray Inspection, Decapsulation, Third-Party Authentication