{"product_id":"cfb270f","title":"CFB270F","description":"\u003cp\u003eCFB270F is a low-flow bonding film \/ prepreg for hybrid multilayer and RF stack-ups.\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eDielectric Constant (10 GHz): 2.65±0.05\u003c\/li\u003e\n\u003cli\u003eDissipation Factor (10 GHz): 0.0017\u003c\/li\u003e\n\u003cli\u003eCTE X\/Y\/Z: 62\/62\/90 ppm\/°C\u003c\/li\u003e\n\u003cli\u003eGlass Transition Temperature: 210 °C\u003c\/li\u003e\n\u003cli\u003eCopper Foil Peel Strength: 4.3 (0.75) lbs\/in (N\/mm)\u003c\/li\u003e\n\u003cli\u003eMoisture Absorption: 0.07 %\u003c\/li\u003e\n\u003cli\u003eDensity: 1.8 g\/cm³\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"My Store","offers":[{"title":"Default Title","offer_id":48993191952567,"sku":null,"price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0757\/5696\/1975\/files\/CFB278F_CFB270F_CFB270F-L.png?v=1786692178","url":"https:\/\/shine-pcb.com\/products\/cfb270f","provider":"My Store","version":"1.0","type":"link"}